Chemical principles developed thermal silica

One-component RTV silicone during the curing process will produce a small molecular gaseous substances , are condensation type organic reactions ( so called condensation type silicone ) , according to the number of small molecules produced such a result is generally divided into categories in turn deacidification type , alcohol type , off oxime , the amide type. RTV-1 silicone type smell different on different substrate corrosion , adhesion of the adhesion of different materials are different, different temperature . For RTV-1 silicone to the manufacturer , the colors of these plastic viscosity and cure rate has been generally can be tailored to the needs .

Thermal silica gel chromatography is based on silica gel adsorption material different leaving the material separating force , generally low polarity substance easily adsorbed onto silica , less polar material difficult to be adsorbed by silica gel , that is, the chromatographic process adsorption, desorption , and then adsorption, desorption process again . Chromatography on silica gel is mainly used for refined petroleum products , removal of aromatic substances or herbal active ingredients for separation and purification of high -purity substances and so on.

Silicone seal is a liquid silicone rubber. By pouring the liquid colloidal surface of the product to make it to the after vulcanization molding products sealed in order to achieve heat , moisture, while , insulation and other effects. The most common is the electronic potting silicone seal .

Silica gel is a colorless transparent oily liquid or skin-colored , soft and elastic after curing a material temperature range of -65 ° C to 200 ° C under long-term use and to maintain its softness elastic properties , with electrical properties and chemical stability, water , ozone resistance, resistance to weathering , non- corrosive, physiologically inert , non-toxic , tasteless, low linear shrinkage .

Component RTV silicone rubber ( RTV-1 silicone short ) relies contact with the adhesive or sealing surface of the water molecules or water molecules in the air cured . Dry and cold environment curing speed can be very slow, but the proper environment , such as more than 25 degrees Celsius, relative humidity of 65% in the case of such glue can dry in 3-30 minutes ( finger dry ) , 24 hours hard work . Different varieties of models of different cure speeds vary.

Silicone wire with high-quality and high-purity silicone rubber made ​​of tinned copper wire . With high temperature resistance, insulation and so on. Widely used in household appliances, lighting , industrial machinery , electric products, such as places of high temperature wiring . Special soft silicone line is generally used in electronics, electrical equipment internal wiring , such as motors , etc., from the general wires.

Depending on the operating mode , is the use of perfusion mode ( packet mode ) can be selected hardness of 20 degrees , 20 degrees hardness silicone mold features: small viscosity , good fluidity , good operation , easy to discharge bulbs , tensile tear strength, easy perfusion.

Silicone is an organic silicon compound , are those containing Si-C bond , and at least one organic group is directly bonded to silicon atoms of the compound , those often customary through oxygen , sulfur , nitrogen, and the organic group and the silicon compounds atom attached as an organic silicon compound . Among them, the silicon-oxygen bond (-Si-O-Si-) for the skeleton consisting of polysiloxane, is the largest number of organosilicon compounds , research deepest , most widely used of a class , accounting for over 90% of the total amount .

Thermal silicone pad silicone products in the market demand is more of a class of products. With silicone properties, there is a certain tension , flexibility, excellent insulation resistance, pressure , high temperature , low temperature , chemically stable , environmentally safe , no smell, food grade silicone pad has a non-toxic tasteless , insoluble in water and any solvent , is a highly reactive green products. food grade silicone mat has inherent thermal stability (-40 ℃ -230 ℃). suitable for different occasions .

Thermal phase change material is a key performance characteristics of the phase change : the material is a solid at room temperature , and easy to handle , can be used as clean and dry mat firmly , for the heat sink or the surface of the device . When it reaches the device operating temperature, the phase change material becomes soft , add a little clamping force , the same material as thermal grease and easily integrates two mating surfaces . This interface is completely filled gap and the gap between the device and the heat sink capacity , making the phase change pad is better than non-current elastomer or graphite based thermal pad, and get similar performance thermal grease .

In practical applications , since it will increase the power causes rapid thermal impedance dropped 10K / W or less, the temperature of foreign industry have developed white LED try to alleviate the above problem by this method , but in fact the calorific power LED smaller than a few times over the high power LED , and the temperature rise of the light emitting efficiency will drop dramatically , even when the package technology allows high-calorie , but there is the LED chip junction temperature may exceed the allowable value , in this case , the solution encapsulation method is the fundamental problem of heat dissipation .

Thermal silica film having a certain flexibility , excellent insulation resistance, compression resistance, a natural surface tack , specifically for the use of heat transfer design slit production to fill the gap , complete heating and cooling heat transfer between the parts , but also played insulation , shock absorption, seals and other effects, to meet the miniaturization and ultra-thin design requirements , is of great craft and usability , and the thickness of the wide range of applications , is an excellent thermal conductivity filler material being widely used in electrical and electronic products.

As electronic devices continue to be more powerful functions into smaller components , the temperature will cause the device to run slower , the device operates halfway out of trouble, and many other dimensions space constraints performance issues . Therefore, the design of the temperature control has become one of the challenges is crucial that austerity in the architecture , the operating space is getting smaller in the case , how to effectively take larger unit power generated more heat .